An effect of sodium dodecylsulfate on the corrosion of copper in sulphuric acid mediaFuchs-Godec, Regina (Avtor) Doleček, Valter (Avtor) electrochemistrycorrosion inhibitorssurfactantspotentiodynamic polarisationcorrosion kinetic parameterscopperLangmuir isothermcritical micelle concentrationsulphuric acidThe effect of sodium dodecylsulfate (SDS) on copper corrosion in a solution of 0.5 M H2SO4 + x M SDS was studied using electrochemical polarisation measurements. The critical micelle concentration (CMC) of SDS in 0.5 M H2SO4 is 8 * 10-4 M, and the experimental concentrations of SDS were in the range below and above the CMC. It was found that SDS is a good anodic inhibitor at lower anodic overpotentials, i.e. very close to the rest potential. Adsorptionof the inhibitor obeys the Langmuir isotherm. Plots of log [▫$theta$▫/(1-▫$theta$▫)] versus log ▫$c_{inh}$▫ yielded straight lines with a slope change at the CMC. Accordingly, the CMC could be determined from these electrochemical measurements. The values of ▫$Delta$▫▫$G_{ads}$▫ calculated from the Langmuir plots are negative, suggesting that the inhibitive action of SDS in 0.5 M H2SO4 results from the electrostatic adsorption of C12H25SO4- ions onto the positively charged copper surface.20042012-06-01 11:36:00Neznano27529UDK: 541.183COBISS_ID: 8985110ISSN pri članku: 0927-7757NUK URN: URN:SI:UM:DK:FCW2LLKGsl