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<metadata xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/"><dc:title>Hardware-in-the-loop simulations: a historical overview of engineering challenges</dc:title><dc:creator>Mihalič,	Franc	(Avtor)
	</dc:creator><dc:creator>Truntič,	Mitja	(Avtor)
	</dc:creator><dc:creator>Hren,	Alenka	(Avtor)
	</dc:creator><dc:subject>hardware-in-the-loop (HIL)</dc:subject><dc:subject>controller-in-the-loop (CIL)</dc:subject><dc:subject>power hardware-in-the-loop (PHIL)</dc:subject><dc:subject>electric drives</dc:subject><dc:subject>automotive</dc:subject><dc:subject>DC-DC converters</dc:subject><dc:subject>inverter systems</dc:subject><dc:subject>grid applications</dc:subject><dc:subject>railway systems</dc:subject><dc:description>The design of modern industrial products is further improved through the hardware-inthe-loop (HIL) simulation. Realistic simulation is enabled by the closed loop between the hardware
under test (HUT) and real-time simulation. Such a system involves a field programmable gate array
(FPGA) and digital signal processor (DSP). An HIL model can bypass serious damage to the real
object, reduce debugging cost, and, finally, reduce the comprehensive effort during the testing. This
paper provides a historical overview of HIL simulations through different engineering challenges,
i.e., within automotive, power electronics systems, and different industrial drives. Various platforms,
such as National Instruments, dSPACE, Typhoon HIL, or MATLAB Simulink Real-Time toolboxes
and Speedgoat hardware systems, offer a powerful tool for efficient and successful investigations
in different fields. Therefore, HIL simulation practice must begin already during the university’s
education process to prepare the students for professional engagements in the industry, which was
also verified experimentally at the end of the paper.</dc:description><dc:publisher>MDPI AG</dc:publisher><dc:date>2022</dc:date><dc:date>2025-04-07 09:16:41</dc:date><dc:type>Članek v reviji</dc:type><dc:identifier>92409</dc:identifier><dc:identifier>UDK: 621.314.572</dc:identifier><dc:identifier>COBISS_ID: 118146563</dc:identifier><dc:identifier>DOI: 10.3390/electronics11152462</dc:identifier><dc:identifier>ISSN pri članku: 2079-9292</dc:identifier><dc:language>sl</dc:language><dc:rights>© 2022 by the authors</dc:rights></metadata>
