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Title:Odkrivanje napak pri polaganju površinsko montiranih komponent : diplomsko delo
Authors:ID Jančar, Sašo (Author)
ID Solar, Mitja (Mentor) More about this mentor... New window
Files:.pdf VS_Jancar_Saso_2019.pdf (2,29 MB)
MD5: 12AB7C2703436016DE51DE6551B2C15A
PID: 20.500.12556/dkum/c6b1efd1-483a-439f-b250-f63921c20e36
 
Language:Slovenian
Work type:Bachelor thesis/paper
Typology:2.11 - Undergraduate Thesis
Organization:FERI - Faculty of Electrical Engineering and Computer Science
Abstract:V diplomskem delu so opisane osnovne komponente kot so paneli oziroma tiskana vezja in elektronske komponente, ki se uporabljajo za kreiranje elektronik. Opisani so tudi vsi procesi, ki so potrebni znotraj SMD (Surface mounted device) linij za ustvarjanje elektronik, kot je nanos spajkalne paste, nalaganje površinsko poleženih komponent, spajkanje le-teh na tiskano vezje in pregledi posameznih operacij. Predstavljene so morebitne napake, ki se lahko pojavljajo na posameznih procesih ter njihovo sedanjo odkrivanje in preprečevanje. Po predstavitvi sedanjega načina odkrivanja napak je podana izboljšava in njene prednosti napram prejšnjemu načinu odkrivanja teh napak.
Keywords:panel, površinsko montirana naprava, elektronike, SMD linija, napake, odkrivanje
Place of publishing:Maribor
Place of performance:Maribor
Publisher:[S. Jančar]
Year of publishing:2019
Number of pages:XIII, 65 str.
PID:20.500.12556/DKUM-75336 New window
UDC:621.3.049.77(043.2)
COBISS.SI-ID:22922518 New window
NUK URN:URN:SI:UM:DK:PCXID0MV
Publication date in DKUM:06.12.2019
Views:1377
Downloads:104
Metadata:XML DC-XML DC-RDF
Categories:KTFMB - FERI
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Licences

License:CC BY-NC-ND 4.0, Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
Link:http://creativecommons.org/licenses/by-nc-nd/4.0/
Description:The most restrictive Creative Commons license. This only allows people to download and share the work for no commercial gain and for no other purposes.
Licensing start date:17.10.2019

Secondary language

Language:English
Title:Detection of placement failures of smd components
Abstract:The diploma thesis describes the basic components such as panels or printed circuits and electronic components which are used to create electronics. It also describes all of the processes required within the SMD (Surface mounted device) line to create electronics, such as applying solder paste, loading surface-mounted components, soldering them to a printed circuit board and examining individual operations. Possible errors that may occur on individual processes and their current detection and prevention are presented. After presenting the present method of error detection, an improvement and its advantages over the former method of the detection of the same errors are given.
Keywords:panel, surface mounted device, electronics, SMD line, defects, detection


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